Dr. Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. Dr. Dory retired from Intel Corporation in the Assembly and Test Technology Development Research division after 20 years in R&D. As Pathfinding Integration Manager of the Intel Substrate Technology Research Labs, he was responsible for development of advanced packaging technology in the areas of MEMS including wafer level bonding, stacked die packages, and line pitch reduction designs. He specialized in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and stacked die and 3D packaging. He was awarded ten patents while at Intel in the areas of embedded package capacitors, underfill applications, and package design. He currently is the R&D manager for formulated products at Fujifilm Electronic Materials, USA.