Conference Agenda





0800 - 0900

Registration of EPCON Asia 2020 - Conference

0900 - 0910

Welcome Remarks


Mr. Selva Nagappan, Managing Director, EPCON Asia 2020

0910 - 0940

Smarter Manufacturing, Smarter Industry

Smart manufacturing represents a leap forward in the manufacturing industry. Automation technology, IoT and AI are utilised to automate management as well as the operation of a factory. There is a lot more than just revamping factory with the latest tech. The Victor Taichug Factory in central Taiwan has their production line operating independently for 72 hours continuously where the activities are monitored by their plant managers on their mobile devices.

  • Automating an industry gives a lot more ease to the company and those working there, what will the future of manufacturing be like for the staff working with advanced tech
  • Is smart manufacturing becoming a must for all factories around the world?
  • How are factories accepting the adoption of smart manufacturing?

0940 - 1010

A New Hope for Hardware with Artificial Intelligence

Every industry has been affected by IR 4.0 and the semiconductor industry is in a position to reap the rewards of the revolution. According to McKinsey, AI could allow semiconductor companies to capture 40 to 50 percent of the total value of the technology percent of the total value of the technology stack, giving them the best opportunity, the industry has had in decades! In this session, hear on:

  • The types of innovations in hardware can be achieved through the use of AI in manufacturing.
  • How much more efficient can the manufacturing industry become through the usage of AI?
  • The strategies that could be implied to increase the revenue of a semi-conductor company.

1010 - 1045

Morning Refreshment & Tour to the Exhibition Area

1045 - 1115

Building the Wall of Defence

In an ever-connected world, security is an ever-growing concern! This has caused organizations in general to buckle up when it comes to security. Semi-conductor companies are also the victim to security breaches. This session discusses on:

  • Should manufacturers use the cloud or local servers to ensure their sensitive data are safe?
  • How will IIoT step-in to secure smart factories?
  • What are the strategies that have been practised by current companies to ensure cyber-attacks are not a headache to them?

1115 - 1200

Panel Discussion: The Important Robots

In the age of IR 4.0, robots are going to be in almost every step of the way of the manufacturing process. Even though Industrial robots have been part of the work force for the past 40-50 years but only now has the application of IR4.0 really taken them off the ground. With the use of AI, robotic systems have literally got a mind of their own now, which allows them to change their actions based on real-time data. In this session, experts from the industry will look into the different aspects of the importance of robotics in the semiconductor industry and strategies implemented in ‘educating’ robots in staying ahead of the current market technology and trends.

1200 - 1230

Electronic Packaging: Being Disrupted!

Disruption has allowed technology to advance at a rate never before seen. According to PWC, back in 1997 to 2007, the semiconductor industry faced drastic changes due to the popularity increment in the production of central processing units and memory chips. In the current era of IR 4.0, an even higher popularity and more changes are expected to be seen as compared to the 10 years period from 1997 – 2007.

  • How are semiconductor manufacturing companies keeping up with the rapid pace of the industrial revolution?
  • What are some of the strategies that have been showing positive impacts in production of central processing units and memory chips?

1230 - 1400

Networking Luncheon & Tour to the Exhibition Area

1400 - 1430

X Marks the Spot with Big Data

Big data is the strongest thing in this day and age when it comes to any industry and with the use of AI, the sky is the limit. Big data is the leading cause of the latest technologies such as machine learning and the government of Japan is now encouraging businesses to share big data and promoting cooperation to drive innovations for Japan’s Society 5.0.

  • How can other part of the world adopt Japan’s Society 5.0 to look forward to the next industrial revolution?
  • Strategies that has been leveraged by the Japanese industries to help push their country ahead of the competition
  • How can other countries leverage on Japan’s Society 5.0 in the new era of IR4.0 to stay ahead of the competition.

1430 - 1515

Panel Discussion: Shaping the Future with Smart Machines

The term “smart machine” implies to machines that are “connected”. The release of new technology increases the expectation of machine operators and system users. Immediate access to information, assurance of safety and security and management of production costs are just some of the key factors of applying smart and connected machines to a factory. In this session, experts from the industry will focus on how smart machines are changing the jobs we once knew and how this will improve work quality as well as yield quality.





Sanjeev Keskar, Managing Director, Arrow Electronics, India

1515 - 1545

Linking the Dots between AI and the Industry

  • How ensuring an incomparable level of quality with the use of AI to allow smart factories to manufacture products at a rate never seen before will give blue collar workers the chance to improve their skills and work in other aspects of the industry.
  • How the implementation of AI will push industries to continuously improve in all aspects?
  • With the rise of AI, companies are given the chance to focus and build themselves non-technical aspect, how will this improve overall status of an industry?

1545 - 1615

The Indian Semiconductor Phase

India has been a country growing with opportunity. The India Electronics and Semiconductor Association reported that the Indian Electronic Systems and Design market is going to be more than US$400Bn by 2022. The government of India is also pushing incentive programs to drive initiatives. There are huge opportunities in India for the Electronic Component manufacturing companies and EMS companies. In this session, our speaker will focus on:

  • What are the emerging opportunities in India for the electronics and semiconductor industry?
  • How leveraging on the latest technologies can push a company into the spotlight.



Sanjeev Keskar, Managing Director, Arrow Electronics, India

1615 - 1645

Evening Refreshment & Tour to the Exhibition Area

1645 - 1730

Panel Discussion: Moving Forward with the Big Guns, Smart Factories

Smart factories are driving innovation and change in the manufacturing industry. Key areas such as efficiency, safety, and quality will be evolving to be better in light of IR 4.0. In this panel discussion, the panellist will discuss how smart factories will change the landscape of the industry through opportunities and challenges that will arise from it becoming more mainstream.

1730 - 1800

Equipping Your Team with the Right Arsenal

IR4.0 gives rise to faster, more efficient and more flexible methods in manufacturing. A concoction of the AI, IIoT, machine learning, cloud computing and advanced analytics has transformed the interaction between employee and equipment allowing an improvement in almost every aspect of manufacturing. According to a study done by PWC, back in 2015 only 33% of companies rated themselves as being advanced, that number has jumped to 70% in 2020! In this session our experts will be discussing on:

  • What is the rate of acceptance of the employee with the implementation of IR 4.0 in the manufacturing industry?
  • What methods should the management team leverage on to push the IR 4.0 initiatives to be more accepted with their employees?

1800 - 1810

Closing Remarks


End of EPCON Asia 2020 - Conference



For electronic devices, solder joints often are the weakest link in terms of reliability. The failure of solder joints may be caused by temperature, stress, electrical current, or chemical reactions, and may occur at level one and level two, depending on the device type and application conditions. In this course, the Part 1 will address the electromigration issue at die attach level for high power devices, and the Part 2 will address the solder joint behavior based on fundamental material properties and the failure modes will be introduced, with emphasis on lead-free solder joints.


Dr. Ning-Cheng Lee