19 Oct 2020 (0900 – 1300) – GMT +8
20 Oct 2020 (0900 – 1300) – GMT +8
For electronic devices, solder joints often are the weakest link in terms of reliability. The failure of solder joints may be caused by temperature, stress, electrical current, or chemical reactions, and may occur at level one and level two, depending on the device type and application conditions. In this course, the Part 1 will address the electromigration issue at die attach level for high power devices, and the Part 2 will address the solder joint behavior based on fundamental material properties and the failure modes will be introduced, with emphasis on lead-free solder joints.
19 Oct 2020 (1400 – 1730) – GMT +8
20 Oct 2020 (1400 – 1730) – GMT +8
The industry is evolving very rapidly, with multiple challenges emerging at the same time on soldering. The cost, the reliability, and the reduced process temperature. Any one failed to address any of those challenges will be left behind in this fierce competitive environment. This course will bring the answer to you, with the most updated information on the new solder materials developed, and will also help you to justify the selection of solder types which fit best for your applications. The course is divided into two parts, with part 1 addressing the cost and reliability, and part 2 address the low temperature soldering.
26 Oct 2020 (0900 – 1300) – GMT +8
27 Oct 2020(0900 – 1300) – GMT +8
With abundant case studies illustrating the principle and application of Design for Manufacturability (DFM) and Design for Reliability (DFR) in advanced soldering technology, you will be able to apply both on your SMT design and process of soldering job and achieve high yield and high reliability very easily, and also be ready to face the new challenges emerged.
2 Nov 2020 (0900 – 1300) – GMT +8
3 Nov 2020 (0900 – 1300) – GMT +8
Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions which is; a) it provides the necessary mechanical support for the components in the circuit; b) it provides the necessary electrical interconnections, and c) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. This one day workshop will discuss a variety of failure mechanisms that effect the functionality of PCBs. These mechanisms can be related to how PCB materials are selected, PCBs are designed, manufactured, tested and used in the field conditions. The workshop will begin with an overview of PCB manufacturing, materials and processes. The workshop then provides the guideline for selection of methodologies for identifying potential failure mechanisms based on the failure history and how a systematic root cause failure analysis of the PCB can result in prevention of future issues.
2 Nov 2020 (0900 – 1300) – GMT +8
3 Nov 2020 (0900 – 1300) – GMT +8
In this workshop the detailed review of failure analysis methods and reliability testing in assembly will be discussed. Quickly finding and eliminating package defects and failures due to assembly issues is critical. Package reliability directly affects manufacturing yield, time to market, product performance, customer satisfaction and cost. Many process steps and controls are needed for a high yield and reliable assembly process. A through understanding of product and technology reliability principles and mechanisms of failure is essential. Knowledge of defects and failure mechanisms enables a high yielding successful assembly process through material choices, package design, process optimization, and thermo-mechanical considerations. Fault isolation, failure analysis, and materials analysis play a major role in the improvement of yield and reliability. Coordination of engineers from many disciplines is needed in order to achieve high yield and reliability. Each engineer needs to understand the impact of their choices and methods on the final product. This workshop will discuss, using examples, mechanical and thermal failure mechanisms in assembly and detection methods.
2 Nov 2020 (1400 – 1800) – GMT +8
4 Nov 2020 (0900 – 1300) – GMT +8
Participants in this workshop will receive a complete overview of current high volume manufacturing, HVM, wire bonding assembly process options and metrology challenges. Miniaturization of wire bonding is critical as the number of bond pads that must be placed per unit area increases. This requires a large leap in wire manufacturing capability and improved wire bonding tools. New challenging assembly processes including direct wirebonding to Cu pads on ULK materials will be discussed. Different methods of wire bonding such as thermosonic, ultrasonic and thermocompression will be covered in this workshop. Several options for Cu wire use are presented in the workshop. Using easy to understand terminology an in-depth review of wire bonding processes in assembly manufacturing and first level interconnects are presented. Package and assembly technologies, wire bonding quality including wire pull and sheer test are discussed in detail. Wire bonding for chip on board, COB, applications, organic substrates, wire bonding problems using Au, Al or Cu wire and tape automated bonding are part of the class. Wire bonding infrastructure is so extensive that no other chip-interconnection technology can completely displace wire bonding in the foreseeable future.
3 Nov 2020 (1400 – 1800) – GMT +8
4 Nov 2020 (0900 – 1400) – GMT +8
Flip chip packaging is not new but new technology requires more connections between the die and package, a tighter bump pitch and more functionally in the package. Tablets and smart phones all use flip chip packaging with thinned die and thin packages. All technology drivers bring new issues that must be addressed. These issues include new copper pillar bonding, bump stack material changes, tighter bump pitch, underfill flow and no-flow options, new under fill materials, thermal management with improved thermal interface materials (TIM), embedded passives, and die attach films. Wafer thinning processes and some stacked die package options will be reviewed. This workshop will begin with a discussion of current flip chip assembly. We will then discuss the new technology options and issues. The objective of this workshop is to provide an improved understanding of current flip chip package options and assembly flows. The newer HVM package material and design options are discussed. Wafer thinning and handling including bonding and debonding methods will be covered. Dicing and handling thin wafers and die will be covered. Newer bump materials will be discussed with their impact to flip chip or stacked die package assembly.
9 Nov 2020 (1400 – 1800) – GMT +8
10 Nov 2020 (1400 – 1800) – GMT +8
The journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes, and an entertaining overview of best practices will be discussed in this workshop. This is based upon real-world problems encountered in troubleshooting process, equipment and materials problems throughout the electronics assembly industry all over the world. Case studies will be used throughout the workshop.
9 Nov 2020 (0900 – 1300) – GMT +8
10 Nov 2020 (0900 – 1300) – GMT +8
11 Nov 2020 (0900 – 1300) – GMT +8
12 Nov 2020 (0900 – 1300) – GMT +8
Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and more sophisticated tools, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes, and loss of resources and customers due to recurrence of failures. The tools and techniques applied by many test and FA labs today are geared only towards uncovering the apparent causes of failure, not necessarily the root causes. Thus, the corrective actions applied by manufacturers or end-users do not always eliminate problems. This can result in expensive, time-consuming, repeat occurrences of failures. This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in electronics. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.
9 Nov 2020 (0900 – 1300) – GMT +8
10 Nov 2020 (0900 – 1300) – GMT +8
11 Nov 2020 (0900 – 1300) – GMT +8
12 Nov 2020 (0900 – 1300) – GMT +8
The SMT Electronics Assembly Class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused two-day long workshop, which provides attendees with the opportunity to learn and understand the processes, equipment, and materials used in today’s manufacture of electronic assemblies. Combining lecture, videos and discussion, this Electronic Assembly Basic Training workshop was designed to give a very comprehensive and complete ‘immersion’ into SMT and mixed technology PCB assembly. As it runs only two days, it is extensive (and non- superfluous) without taking people ‘out of the shop’ for an extended period of time: learn, absorb and take that knowledge back to the manufacturing floor.
Suha has diverse experience in the semiconductor industry where she started her career as a Test Development Engineer and paved the way to Hardware Design Engineer, then Technical Program Manager and Site Quality Manager. Currently, she is leading worldwide system integration operations, engineering operations, and supply chain for Micron. Suha is a passionate leader that drives transformations, a change agent, and a believer that talent management of the present and future is the key to success for an organization. She has been leading a women network throughout her career and leading the Asia region Micron Women Leadership Network.
CS Tan graduated from USM in 1991 with a 1st Class Honours degree in Applied Physics and a winner of the Faculty Gold Medal. He also holds an MBA from USM. CS started his career in National Semiconductor Penang and has an illustrious career spanning over 30 years covering industries such as Semiconductor, Hard Disk Storage, and Electronics Manufacturing Services. In the past 15 years, CS has been the General Manager of large MNC factories, such as Flextronics, ON Semiconductor, and ST Microelectronics where he is currently based in. Throughout his career, CS Tan has led various important manufacturing initiatives such as Lean Manufacturing, Total Quality Management, Reliability Centred Maintenance, and more recently Industry 4.0 (Connected Manufacturing). CS Tan has spoken in various industry seminars and workshops in diverse fields such as Supply Chain Management, Factory Security, and Smart Manufacturing. He was also recently appointed as Adjunct Professor to the Faculty of Electrical and Electronics Engineering in UTEM, Melaka.
Howie Chang is the co-founder and CEO of Forward School, an accredited revolutionary technology and future skills school in Malaysia. He leads the growth and development of the company, with the goal of providing the best digital-age education in Southeast Asia. Having spent the formative years of his career in Singapore, he has a long experience in product management, user experience, and digital business transformation in various industries. Howie also had stints with startups of all kinds, where he delved into the dynamic intersection of design, business, and technology. He was also the Head of Design at Viki and Director of Product Management at RedMart, both of which resulted in two of the most notable tech acquisitions in Southeast Asia.
Mr. Shamsul is a technologist with experience in manufacturing and software development with MNCs, local corporations, and the government. Among companies that he has worked with, are Hewlett Packard, Altera Corporation, Quantum Peripheral, and Sapura Research. He is currently leading the software development team in MIMOS Berhad in Kulim Hi-Tech Park.
Shanmuganathan (Shaan), is a transformational leader with high interpersonal skills and a passion for innovation. He is the current Kontron’s Malaysia Chief Executive Officer (CEO). Prior to joining Kontron, after a short stint in Malaysia upon graduating from the USA, he was based in overseas assignments in Hong Kong, China, and Canada where he was involved in various R&D Groups developing and manufacturing products for consumers, RF, Medical and embedded industries. He returned to Malaysia to continue contributing to the R&D field. With his passion and versatile executive capabilities in engineering with a development background, he managed to transform Kontron Malaysia from a manufacturing incline company to today’s R&D CoE (Centre of Excellence) for Kontron embedded boards, systems, and IoT (Internet of Thing) mainly focusing vertical applications in Industrial 4.0, Avionics and Transportation. Shaan begins his career as an RF engineer and continue building his career holding various technical and executive management positions through his 30 years tenure. He holds BSc. Electrical Engineering (Major in Electronic and System Control), USA and Master in Business Administration (MBA), Malaysia. In 2021, appointed as EEPN Chairperson for Strategic Initiatives 4 (Enable and Forge a Robust E&E Ecosystem) and Member of the Penang Socio-Economic Recovery Consultative Council (PSERCC) Industry / SMI / SME Working Committee.
Sakthivel Narayanasamy or better known as Sakthi is the Chairman of Quantum Computing Sdn Bhd – a respected regional specialist in Automation Solutions. He has been in the engineering industry for the past 30 years leading local and regional projects in diverse industries. Sakthi has worked in a number of multinational companies such as General Electric and Siemens. He was a Senior Systems Engineer in Siemens Malaysia before he founded his own business ventures. The international exposure and engineering best practices gained in these companies have contributed to his ability to develop and innovate automation solutions that are practical, sustainable, and scalable with a business focus.
Swee Kiang (SK) Fong has more than 30 years of experience in the semiconductor industry. He started his career and worked in Intel for more than 20 years in various technical and management positions in US and Malaysia. He was instrumental in starting up Intel Design Center in Malaysia and growing the organization to 1500 people responsible for microprocessor, Chipset, SOC design, and development. He then joined Altera Corporation as VP of R&D, leading the development of advanced FPGA, IP, and Quartus software in Malaysia. He was the senior director of Broadcom Corporation overseeing the global operation of a USD1B division before starting up SkyeChip. SK holds a First Class BSEE degree from the University of Technology, Malaysia; and earned his EMBA degree (Beta Gamma Sigma) from Olin School of Business WUSTL, Missouri, and Shanghai Fudan University, China.
Balan Krishnan has more than 24 years of HR and Manufacturing under his belt. He has worked in various locations in Asia throughout his career at Intel and Altera, namely in Shanghai, Ho Chi Minh City and Singapore. He is currently the Head of HR at Dexcom a world leader in Continuous Glucose Monitoring device. He oversees a start-up of a brand new manufacturing plant in Penang which will grow from less than 10 employees to more than 3000 in a couple of years. Balan is a strong advocate of Diversity, Equity and Inclusion and was named one of Malaysia’s 50 leaders of Diversity and Inclusion back in 2012. He is a certified John Maxwell coach and facilitator. Balan graduated with an Arts degree from USM. Balan tries to live up to his credo of “Carpe Diem” after being inspired by the movie, The Dead Poet’s Society.
Bor Chun is Keysight Vice President and General Manager of Global Services for Greater China and the Asia Pacific. He has amassed a wide range of experience in the international arena. His expertise includes global marketing, strategic planning, business development, and the acquisition of new businesses. Since 2015, he become the leader of the Services organization and lead the team to continuously grow the business at double digits YoY. He is also an invaluable consultant for various areas other than marketing, with years of significant influence upon decisions in finance, administration, and customer support.
Highly articulate, focused, and dedicated human resource leader with over 15 years of HR Generalist experience and a record of achievement serving in various MNCs. Equipped with legal knowledge, expertise in conducting human resource planning, policy development, and implementation, employee relations, recruiting and hiring practices, personnel, and organizational development, rewards and recognition, and performance management systems. Serve as a collaborative business partner to align organizational goals and facilitate productive and proactive programs that fuel high-performing organizations. Demonstrated experience initiating cost containment strategies resulting in significant savings. Proven skills in labor and employment law including complaint investigation to thwart legal action.
Kalai Selvan Subramaniam has more than 30 years of experience in the electronics/semiconductor industry with leadership positions in Technology Start-Ups to Tier-1 Semiconductor MNCs. He is passionate about setting up organizations from the ground up. He has been instrumental in setting up local capabilities to provide value add E&E engineering services, especially in the area of Semiconductor IC Design and Product Development to Tier-1 Electronics and Semiconductor companies. He is the Co-Founder CEO of Infinecs Systems Sdn. Bhd. Prior to that, he was the General Manager of USains Infotech Sdn. Bhd.
Fawnizu Azmadi Hussin has published more than 130 research papers and holds 6 patents under his name. He graduated from University of Minnesota (USA) in 1999, University of New South Wales (MSc-2001) and Nara Institute of Science and Technology (PhD-2008). Fawnizu was the Chair of IEEE Malaysia Section (2019-2020) and IEEE Circuits & Systems Malaysia Chapter (2013-2014) and was awarded the 2018 Region 10 (Asia Pacific) Outstanding Volunteer Award. He was Deputy Head of E&E department (2013-2014) and Director of Strategic Alliance Office (2014-2018) at Universiti Teknologi Petronas and Visiting Professor at Intel Malaysia (2012-2013) and Malaysia-Japan International Institute of Technology (MJIIT, 2020).
Mr. Shuras Vasu has more than 24 years of operation excellence applying various analytical tools for decision making and continuous improvements. He carries with him strong expertise of Lean Six Sigma, Shop Floor Management, TPM, TQM, CQE and QMS. He has also implemented many TPM initiatives for his organisation especially on the OEE improvements under the Japan Institute of Plant Management. He had the great opportunity to implement the World Class Manufacturing System called New Shop Floor Management. He is well versed with the 5 core tools applications for Automotive Manufacturers.
Dr. Tom Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. He left Intel Corporation where he handled Assembly and Test Technology Development Research Division after 20 years. He specialized in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and stacked die and 3D packaging. He was awarded ten patents while at Intel in the areas of embedded package capacitors, underfill applications, and package design. He currently is the R&D manager for formulated products at Fujifilm Electronic Materials, USA.
Mr. Phil Zarrow has been involved with PCB fabrication and assembly for more than 35 years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, he is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. He has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
Mr. Bhanu Sood is a Center Lead and Commodity Risk Assessment Engineer at NASA Goddard Space Flight Center. He serves as an agency expert and center specialist who manages overall center development efforts pertaining to electronic circuit assembly in Goddard Space Flight Center ground and flight missions. He serves as an agency authority on technical committees and advisory groups and manages the establishment and implementation of new research, technology development and technology demonstration initiatives relating to electronic circuit assemblies. His areas of expertise include electronics supply chain risk/reliability assessment, root-cause failure analysis and strategies for counterfeit parts prevention. He is the chair of three SAE Aerospace Standards Committees. He holds one patent, and two invention disclosures as well as the position of senior member of IEEE and member of SAE and ASM.
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries and extensive experience in the development of underfills and adhesives. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology.
I’ll tell them you went down prying the wedding ring off his cold, dead finger.
It’s toe-tappingly tragic! Well, let’s just dump it in the sewer and say we delivered it. No! The kind with looting and maybe starting a few fires! Of all the friends I’ve had… you’re the first.
Ah, the ‘Breakfast Club’ soundtrack! I can’t wait til I’m old enough to feel ways about stuff! I’ve got to find a way to escape the horrible ravages of youth. Suddenly, I’m going to the bathroom like clockwork, every three hours. And those jerks at Social Security stopped sending me checks. Now ‘I” have to pay ”them’!