Mr. Bhanu Sood is a Center Lead and Commodity Risk Assessment Engineer at NASA Goddard Space Flight Center. He serves as an agency expert and center specialist who manages overall center development efforts pertaining to electronic circuit assembly in Goddard Space Flight Center ground and flight missions. He serves as an agency authority on technical committees and advisory groups and manages the establishment and implementation of new research, technology development and technology demonstration initiatives relating to electronic circuit assemblies. His areas of expertise include electronics supply chain risk/reliability assessment, root-cause failure analysis and strategies for counterfeit parts prevention. He is the chair of three SAE Aerospace Standards Committees. He holds one patent, and two invention disclosures as well as the position of senior member of IEEE and member of SAE and ASM.
Mr. Shuras Vasu has more than 24 years of operation excellence applying various analytical tools for decision making and continuous improvements. He carries with him strong expertise of Lean Six Sigma, Shop Floor Management, TPM, TQM, CQE and QMS. He has also implemented many TPM initiatives for his organisation especially on the OEE improvements under the Japan Institute of Plant Management. He had the great opportunity to implement the World Class Manufacturing System called New Shop Floor Management. He is well versed with the 5 core tools applications for Automotive Manufacturers.
Dr. Tom Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. He left Intel Corporation where he handled Assembly and Test Technology Development Research Division after 20 years. He specialized in packaging and assembly, focusing on high density substrate manufacturing, and chip assembly including flip chip and stacked die and 3D packaging. He was awarded ten patents while at Intel in the areas of embedded package capacitors, underfill applications, and package design. He currently is the R&D manager for formulated products at Fujifilm Electronic Materials, USA.
Mr. Phil Zarrow has been involved with PCB fabrication and assembly for more than 35 years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, he is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. He has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world.
Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has more than 30 years of experience in the development of fluxes and solder pastes for SMT industries and extensive experience in the development of underfills and adhesives. He serves on the board of governors for CPMT and served on the SMTA board of directors. Among other editorial responsibilities, he serves as editorial advisory board of Soldering and Surface Mount Technology, Global SMT & Packaging and as associate editor for IEEE Transactions on Components Packaging Manufacturing Technology.
I’ll tell them you went down prying the wedding ring off his cold, dead finger.
It’s toe-tappingly tragic! Well, let’s just dump it in the sewer and say we delivered it. No! The kind with looting and maybe starting a few fires! Of all the friends I’ve had… you’re the first.
Ah, the ‘Breakfast Club’ soundtrack! I can’t wait til I’m old enough to feel ways about stuff! I’ve got to find a way to escape the horrible ravages of youth. Suddenly, I’m going to the bathroom like clockwork, every three hours. And those jerks at Social Security stopped sending me checks. Now ‘I” have to pay ”them’!